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Electrophoretic depositable (ED) photoresists12,13 were introduced in the late 1980s with expectations of broad adoption by the interconnect industry. The early materials were modifications of those used for coating automobiles and appliances. These fast-coating processes provide a defect-free film of high durability on conductive substrates and are well suited to large-volume production.Anodically and cathodically deposited materials that are both positive and negative acting have been introduced but have achieved limited market penetration in the interconnect industry. Advances in dry-film photoresists and liquid photoresists reduced the interest in implementing a new photoresist process. (A detailed discussion of electrophoretic depositable photoresists is included in Sec. 17.1.6 of the fourth edition of this handbook.)

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Imaging is a sequential process, and the various steps are very interdependent. Equipment and processing conditions play a large role in the image quality, yield, and productivity that can be achieved. The choice among the numerous options for each step depends on the type of substrate to be imaged, the feature sizes to be produced, the existing equipment, the type of photoresist, and the productivity and economics of the production line. Alternatives for each process step are described and compared.

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Cleanliness Considerations Cleanliness is an issue throughout the entire photolithography process, including yellow room contamination level (cleanliness class), solution filtration, equipment cleanliness class, and product handling. Its importance increases as feature size decreases. The level of cleanliness needed to give acceptable yield for the finest features must be established and maintained. Sticky rollers, either as free-standing equipment or as handheld items, are one type of equipment used to remove contamination from flat surfaces, either panels or equipment.

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Surface Preparation Good adhesion between the photoresist and the substrate is essential for the remainder of the process to be successful. All laminates arrive at the imaging area, dirty, and the exact process sequence for surface preparation is chosen based on the nature of the contamination. Epoxy dust generated during trimming and processing of the laminate is removed by mechanical cleaning. The copper surface is either foil or foil with electroless or electroplated copper. Foil typically has an antitarnishing agent of chromium and zinc that must be removed for reproducible imaging results. During cleaning, the texture or surface roughness of the copper is altered, promoting mechanical adhesion between the copper and the photoresist. The extent of this texturing is measured by the usual parameters for surface roughness, the height and spacing of the topography measured by profilometry (see Fig. 26.6).

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TABLE 26.2 Copper Surface Chemical Composition as Measured by X-Ray Photoelectron Spectroscopy (XPS) Sample Initial Preclean 1 Preclean 2 % Cu 12 6 %O 46 19 10 %C 24 68 70 %N % Zn 16 14 % Cr 12

Chemical cleanliness can be determined in a variety of ways. Wetting is often tested using a water break test or more analytically in terms of contact angle, with a low value being desirable. In addition, analytical techniques (Auger and x-ray photoelectron spectroscopies) can be used to evaluate the chemical composition of the surface (see Table 26.2).14 26.6.2.1 Mechanical Cleaning. Most mechanical cleaning equipment physically abrades the copper surface using a pumice or aluminum oxide slurry either directly (scrubbing or vapor blasting) or impregnated into brushes. Scrubbing provides an even final surface texture, whereas brushing creates grooves (see Fig. 26.7). The copper thickness must be sufficient to provide the desired final conductor height after cleaning. Mechanical cleaning is more difficult for very thin flexible panels.

FIGURE 26.7 Comparison of the pumice cleaned (a) and mechanically abraded copper surfaces (b), 1200 . (Reprinted with permission of D. P. Seraphim, R. C. Lasky, and C-Y Li, Principles of Electronic Packaging, McGraw-Hill, 1989, p. 383.)

The texture of the mechanically cleaned surface affects the adhesion between the photoresist and the copper.The resist should conform to the topography, and thus, the extent and type of texture must be tailored to the type of photoresist. If the gouges are too deep, a dry film applied with traditional lamination will have difficulty conforming to the surface and create defects: near or full opens after etching, and underplating or shorts after pattern plating. Thus, the cleaning process, photoresist type, and application method must be matched to image at high yields. Conveyorized equipment is used that passes the panels through the brushes or slurry and then to rinse chambers before exiting through a dryer section. If rinsing is insufficient, residual

Surface analysis (structure)

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UWP Bar code generator - MSDN - Microsoft
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