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access on processors that have the capability. PortA becomes AD0-7, PortC becomes A8-15, and WR* and RD* signals are activated on PortD as alternate pin functions. When this bit is 0, the ports function as normal ports and external SRAM access is disabled. Bit6:SRW. External SRAM Access Wait State Bit. When this bit is 1, an extra wait state is inserted in the SRAM access cycle. Thus the SRAM is accessed in 4 cycles. When this bit is 0, the SRAM is accessed in 3 cycles. Bit5:SE. Sleep Enable. Setting this bit to 1 enables the processor to go in one of the sleep modes. After setting this bit to 1, the program must execute the SLEEP instruction. Bit4:SM. Sleep Mode. A 1 in this bit puts the processor in idle mode. A 0 means power down mode. Bit3, 2:ISC11, ISC10. Interrupt sense control bit for INT1 as per Table 3.2. Bit1, 0:ISC01, ISC00. Interrupt sense control bit for INT0 as per Table 3.3.

For any of these techniques, the cleanliness of the operation both the equipment and the room and the handling of the product are critically important, especially for high density It is also advisable to minimize handling at this stage by using automated inline equipment for the preclean step and automatic loading and unloading 26631 Dry-Film Hot Roll Lamination In this process, both temperature and pressure are used to laminate the dry-film photoresist to the panels After stripping off the polyethylene.

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separator sheet, the photoresist is contacted to the substrate in a nip between two heated rolls Heat reduces the viscosity of the photoresist and pressure causes it to flow, conforming to the irregularities of the copper surface The weave of the laminate affects the topography of the substrate and how much flow is required to achieve good conformation, an essential condition for high yield Dry-film photoresists are tailored to have rheology that maximizes flow during lamination while preventing flow in the roll prior to lamination, which could cause edge fusion Panels are often heated with heated rolls and infrared heaters prior to lamination to improve photoresist conformation The key process parameters affecting conformation are laminator speed, laminating roll temperature, and rigidity of the rolls with respect to the core material and rubber durometer For aqueous-developable materials, wet lamination has proven to be effective in improving conformation and yield for innerlayers.

By using a water-alcohol mixture, wet lamination can also be applied to tent and etch inner via holes to minimize the land diameter18 Both automatic and manual tools are available for film lamination (see Fig 268)With manual tools, the panel is placed in the nip and pulled through by the rotation of the rollers The continuous film of photoresist must be trimmed for each panel on at least two sides This technique is labor-intensive and extremely dirty due to the chips of resist generated by trimming However, it is useful for very thin materials and nonstandard-size panels in small lot sizes With automatic equipment, the basics are the same but the panel enters from an automatic loader or a conveyorized preclean tool directly into and through the dry-film laminator.

Reactive abrasive grains, lapping plates, lapping liquids, ions, laser, electrons, X-rays, photo-resist (E)

This is a relatively clean operation with little handling of the panels since the photoresist is automatically trimmed to the appropriate size and placed within the board edge..

FIGURE 26.8 Configuration of a hot roll laminator: (a) three-dimensional schematic; (b) two-dimensional schematic. (Reprinted with permission of E. S. W. Kong, Polymers for High Technology, ACS Symposium Series 346, Washington,D.C., 1987, p. 280.)

FIGURE 26.8 (Continued)

The MCU status register provides information about the source of reset. (Figure 3.12.) The MCUSR contains 2 bits which indicate the source for the reset as per Table 3.4.

Equipment is available to convey even very thin panels Panels are often heated, wetted (wet lamination), or cleaned before the actual lamination 26632 Dry-Film Vacuum Lamination This method is similar to hot roll lamination but the temperature and pressure used to adhere the photoresist to the substrate is applied by a heated vacuum platen instead of laminating rolls Vacuum lamination is useful for products with tall or closely spaced features that make it difficult for the photoresist to conform The vacuum removes the air that would be trapped and pulls the photoresist into tight spaces, providing conformal coverage This equipment is also used for material that will deform nonuniformly under the pressure of laminating rolls, such as thin unreinforced polyimides With vacuum lamination, the pressure is evenly distributed over the panel, improving dimensional stability control 26633 Liquid Coating.

EEM, mechanochemical lapping, reactive lapping, laser heat treatment, PVD (physical vapor deposition), electron beam exposure, SOR exposure Non-contacting lapping, ion machining, sputter etching, reactive etching, sputter deposition, ion plating, ion implantation Substance synthesizing processing (atomic or molecular arrays, molecular beam machining)

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