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Figure 127 shows an example of a typical DMA scan The material has a Tg of 19317 C 12522 Coefficient of Thermal Expansion (CTE) The CTE describes the property of materials to expand as they are being heated Because of the reinforced composite construction of most laminates, the CTE in x and y direction is usually different from the CTE in z direction By convention, the x direction corresponds to the warp direction of the reinforcement, whereas the y direction corresponds to the fill direction of the fabric The z direction is the direction perpendicular to the plane of the laminate The difference between the values is caused by the reinforcement, which severely restrains the expansion in x and y, whereas the resin can expand unrestrained in the z direction.

For copper-clad laminate materials used in printed circuit boards, the CTE in x, y, and z direction is of great importance The x and y direction is critical because of all the components that will be mounted on the final printed circuit board The greater the mismatch between the laminate material and the soldered components, the higher the risk that temperature changes will lead to solder fatigue and eventually to a reduction in the reliability of the board The z direction is of equal importance because the expansion of the laminate during thermal cycles will lead to stresses in the copper plating (CTE of 17 ppm/K) of the plated through or buried holes in the board A low z-axis CTE and high Tg are therefore generally desirable for increased through hole reliability A number of different measurement techniques are available to determine the CTE of copper-clad laminates.

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The most commonly used is TMA following IPC-TM-650, method 2424C, as described in Section 1221 When determining the CTE of a laminate, the temperature scan must start at a temperature sufficiently lower than the specified temperature range.

for which the CTE is being determined to allow the heat rate to stabilize. The typical scan rate is also 10 C (18 F) per min. and the scan should be continued to at least 250 C (482 F). Because the expansion properties of the material change at Tg, there are usually two CTE values that are being reported: the CTE below Tg is commonly referred to as a1, and the CTE above Tg as a2 (see Eq. 12.4). CTE:a = L/ T ppm/K where L = change in length T = change in temperature K = degrees Kelvin (12.4)

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In the TMA scan example (Fig 125), the material has a z-axis CTE(a1) of 65ppm/K and a z-axis CTE(a2) of 150 ppm/K The CTE in x and y direction can also be measured by TMA, although care must be taken during the preparation of the sample to avoid any influence of reinforcement material on the TMA probe The results are strongly dependent on the properties of the reinforcement fabric Another method to determine the x- and y-axis CTE of laminate materials employs strain gauges This method is described in IPC-TM-650, method 24412 Many details need to be taken into consideration when making use of this method The strain gauges need to be calibrated for the specific temperature range and the adhesive used to attach them needs to be stable over the whole range Special care needs to be taken during specimen preparation and gauge attachment.

It is recommended to run one heat cycle prior to the actual measurement to remove any residual stresses More details can be found in IPC-TM-650 12523 Thermal Resistance The thermal resistance of laminate materials is one of the key properties, especially in light of the lead-free processing conditions It is the most important indicator of the performance of printed circuit boards during assembly operations As already mentioned in the Sec 121, most printed circuit boards will be required to withstand at least five reflow cycles with a peak temperature in the range of 260 C, but that number may increase to six and above for more complex assemblies During exposure to these process temperatures, the laminate cannot delaminate or begin decomposition.

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